Lidrotec GmbH develops fluid-assisted laser technology for wafer dicing of microchips and devices, with semiconductor, energy, medicine and electronics applications.
Lidrotec GmbH, a German company, develops laser technology for wafer dicing - the high-precision cutting of microchips and devices. Its core product, LidroCUT® – Laser Dicing in Liquids, processes wafers with a laser while controlled fluids work in parallel. The fluids cool the workpiece surface to avoid heat-related defects, bind and rinse nano- and microparticles to prevent surface debris, and optimise laser ablation through physicochemical interaction between laser beam, liquid and workpiece.
The approach yields burr-free, sharp cutting edges at minimal cutting widths and high aspect ratios, and leaves clean chip surfaces requiring no additional post-treatment steps. The system supports multiple processing modes. Technical domains span laser dicing, laser ablation and fluid-assisted laser processing, applied to semiconductor manufacturing equipment.
Lidrotec serves the semiconductor, energy, medicine, electronics and material science sectors, and describes its work as semiconductor equipment made in Germany. The company cites a culture of innovation, openness and teamwork.
