QP Technologies

QP Technologies, established in 1992, is a provider of microelectronic packaging and assembly, wafer preparation, and substrate design and development services. Based in a 20,000-square-foot facility in Escondido, California, the company specializes in IC packaging technologies, advanced assembly, and design engineering.

Its product offerings include over-molded QFN/DFN packages, pre-molded air-cavity QFN packages, and custom substrate solutions. These technologies support applications in technical areas such as compound semiconductors and power semiconductors.

The company operates across industry verticals including automotive, aerospace, mil-aero, medical, and industrial sectors. QP Technologies holds certifications such as ISO 9001:2015, ISO 13485:2016, AS9100D, and is ITAR registered.